- Polymer Name:Polyamide 6/66 (PA 6/66)
- Processing Methods:Extrusion Coating, Extrusion, Injection Molding, Compounding
Aegis® H55C2ZP is a 2.7 RV, unfilled, medium viscosity, non-lubricated, polyamide 6/66 copolymer for molding or compounding. With a broad processing window and excellent melt fluidity for filling thin sections, it provides exceptional processability. Aegis® H55C2ZP resin combines strength, stiffness and toughness with chemical and abrasion resistance. For glass- or mineral-filled applications, Aegis® H55C2ZP resin also offers superior surface appearance and low warp.